| X-Ray Photoelectron Spectroscopy (XPS/ESCA) (2 days) | |||||||
| AES is used to determine the atoms present at a surface, their concentrations, their chemistry, and their lateral and depth distributions. | |||||||
| Hours: 8:30 am-5pm, Lunch on your own | |||||||
| Printed notes will be provided to participants | |||||||
| Day 1: | |||||||
| • | Introduction ö terminology, surfaces, types of surfaces. 0.5 hour | ||||||
| • | The principles of XPS ö production of photoelectrons, peak labeling, electronic figuration of atoms, atoms, molecules, solids, energy, spectra, Auger process, valence spectra, handbooks, books, surface sensitivity, information depth, sample handling, spin-orbit splitting, chemical shift, plasmons, multiplet splitting, shake-up. 3 hours | ||||||
| • | Instrumentation ö dual anode, Bremsstrahlung, monochromatic source, electron energy analyzers, spectrum acquisition, energy resolution, scattering in analyzers, electron detectors, pulse counting, position sensitive detectors, small area analysis, area location, imaging XPS, methods, equipment and examples, vacuum system, samples, energy scale calibration. 3.5 hours | ||||||
| Day 2: | |||||||
| • | Qualitative analysis ö identification of elements, changing x-ray sources, charging, interpretation of chemical shift, relaxation effects, Auger parameter, peak widths, lineshapes. 2 hours | ||||||
| • | Quantitative analysis ö sensitivity factors, ionization cross section, asymmetry parameter, analyzer transmission, reference spectra, intensities, background subtraction, detection limit, effect of thin overlayers. 2 hours | ||||||
| • | Artifacts ö x-ray damage, charging, methods for charge control, ghost peaks. 0.5 hour | ||||||
| • | Data acquisition and processing ö processing data, Tougaard background subtraction, satellite subtraction, peak area, lineshapes, curve fitting, deconvolution. 1 hour | ||||||
| • | Depth profiling ö non-destructive and destructive methods, angle resolved XPS, diffraction, elastic scattering, thickogram, inelastic loss method, sputtering, depth calibration. 2 hours | ||||||
| • | Applications ö some further examples of applications of XPS. 0.5 hour | ||||||
| • | Instrument selection and summary ö factors to consider, general summary. 0.2 hours | ||||||